| Alloy Type | : | Solder |
| Chemical Composition | : | Tin 49.5-51.5%;Lead Remainder% |
| Color | : | Gray/Silver metallic |
| Composition | : | 50% Lead, 50% Tin |
| Container Type | : | Spool |
| Diameter | : | 1/8" (3.18mm) |
| Liquidus | : | 421 deg F (216 deg C) |
| Melting Temperature | : | 421 deg F |
| ModelName | : | 50/50 Solder |
| Net Content | : | 1 lb |
| Recommended Flux | : | Stay-Clean liquid or paste soldering flux is recommended for most base metals. Stay-Clean is not recommended for electrical or electronic applications. |
| Size | : | 1 lb. spool |
| Solidus | : | 361 deg F (183 deg C) |
With some exceptions, these tin lead solders can be used to join copper and most copper alloys, lead, nickel alloys and steel. Tin lead solders are not recommended for joints subject to high stress or vibration in the cooling industry due to lack of sufficient elongation properties.
Harris® Solder Wire, 1 lb Net Content, Spool Container, 1/8 in Diameter, 421 deg F Melting Temperature, Composition: 50% Lead, 50% Tin
- Can be used to solder copper and most copper alloys, lead, nickel alloys, and steel with some exceptions
- Used primarily for general purpose soldering applications including sheet metal work
- Heat sources include soldering guns, irons and air-fuel torches
- Not recommended in high stress or vibration joints in the cooling industry due to lack of sufficient elongation properties
- Not for use with plumbing and potable water system applications
- Meets ASTM B-32 specifications; Alloy Grade Sn 50; J-STD-006 Sn50Pb50Sb0.4